3D X-ray CT for BGA/CGA Workmanship Defect Detection
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منابع مشابه
Comparison of X-ray Inspection Systems for BGNCCGA Quality Assurance and Crack Detection
The use of x-ray technique now become an additional inspection tool requirement for quality control and unique defect due to manufacturing for implementation of advanced electronic packages such as ball grid array (BGAs) and chip scale packages (CSPs). Recently, four x-ray systems were evaluated for their defect detection capability especially for damagekracks induced during thermal cycling of ...
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تاریخ انتشار 2012